Description potting silicone
Supex 2210 is an organic electronics potting silicone compound that cures at room temperature or with heat. It is a two-component, elastic silicone material specifically formulated to protect electronic products in harsh environments.
Supex potting silicone utilises advanced technology that enables curing without heating. When mixed thoroughly at a ratio of 1:1 (by weight or volume) of components A and B, the product will cure into an elastic, cushioning material within a specified timeframe.
After curing, the compound exhibits the following properties:
- Resistant to moisture, dirt, and other atmospheric contaminants
- Reduces mechanical and thermal shocks, vibrations, and related stress
- Easy to rework or repair
- Excellent high-frequency electrical performance
- Solvent-free with no cure by-products
- Stable mechanical and electrical properties across -50°C to 250°C
- Excellent flame retardancy
Physical Properties of potting silicone
| Item | Testing Standard | Unit (25°C) | A Component | B Component |
|---|---|---|---|---|
| Appearance | Visual Inspection | — | Black viscous liquid | White viscous liquid |
| Viscosity | GB/T 10247-2008 | mPa·s | 4500 ± 600 | 3500 ± 600 |
| Density | GB/T 13354-92 | g/cm³ | 1.50 ± 0.05 | 1.50 ± 0.05 |
Processing Parameters
| Testing Item | Unit/Conditions | Value |
|---|---|---|
| Mixing ratio (weight) | — | 1:1 |
| Mixing ratio (volume) | — | 1:1 |
| Mixed viscosity | mPa·s (25°C) | 4000 ± 1000 |
| Mixture density | g/cm³ (25°C) | 1.50 ± 0.05 |
| Operating time (1) | minutes (25°C) | 50 ± 10 |
| Curing time | °C/hr | 60°C/0.5 hr or 25°C/10 hrs |
How to use Supex electronics silicone
Mix components A and B in a 1:1 ratio and stir thoroughly. Degas under vacuum during the working time, then pour the mixture onto the product to be encapsulated. For larger encapsulations, it can be poured in stages. The compound cures under the following conditions:
- 60°C for 30 minutes
- 25°C for 10 hours
Precautions
- Part A may settle over time; stir before use and reseal after opening.
- Always stir in the same direction to minimise bubble formation. Ensure material at the container’s edges and bottom is evenly mixed to avoid uncured areas.
- Degassing before pouring improves final product performance.
- Low temperatures may slow curing; heating is recommended. Do not cure more than 2 cm thickness at 80°C to avoid thermal runaway.
- The compound may fail to cure if it contacts substances containing nitrogen (N), sulphur (S), phosphorus (P), or heavy metal ions (Sn, Pb, Hg, Bi, As, etc.).
Typical Properties
| Testing Item | Standard | Unit | Value |
|---|---|---|---|
| Hardness | GB/T 531.1-2008 | Shore A | 55 ± 5 |
| Thermal Conductivity | GB/T 10297-1998 | W/m·K | 0.8 |
| Coefficient of Expansion | GB/T 20673-2006 | μm/(m·°C) | 210 |
| Water Absorption | GB/T 8810-2005 (24h, 25°C) | % | 0.01–0.02 |
| Flame Retardancy | UL-94 (3 mm, 105°C) | — | V-0 (E315820) |
| Dielectric Strength | GB/T 1693-2007 | kV/mm (25°C) | >25 |
| Loss Factor | GB/T 1693-2007 (1MHz) | — | 0.01 |
| Dielectric Constant | GB/T 1693-2007 (1MHz) | — | 3.3 |
| Volume Resistivity | GB/T 1692-92 (DC500V) | Ω·cm | 1.0 × 10¹⁵ |
Packaging
- Part A: 10 kg/pail
- Part B: 10 kg/pail
Storage and Transportation
- Store both components away from light and heat, and reseal tightly after opening.
- Can be transported and stored as non-hazardous goods.
- Shelf Life: 1 year at 25°C
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