Description of Supex potting epoxy
- Supex 1102 Epoxy Potting Compound is a room temperature or heat-curing epoxy resin. This two-component adhesive is designed for high-strength and secure electronic applications.
- Supex 1102 cures at room temperature without the need for heating. When parts A and B are thoroughly mixed in a 4:1 weight ratio, the product cures over time to form a protective barrier.
Post-Curing Characteristics
- Resistant to moisture, dust, and other environmental factors
- High mechanical strength
- Provides confidentiality (tamper resistance)
- Solvent-free, with no curing by-products
- Stable mechanical and electrical properties between -45°C and 120°C
Typical Physical Properties (Before Mixing)
| Test Item | Testing Standard | Unit | Part A | Part B |
|---|---|---|---|---|
| Appearance | Visual inspection | — | Black viscous liquid | Brown liquid |
| Viscosity | GB/T 10247-2008 | mPa·s (25°C) | 15,000–35,000 | 100–150 |
| Density | GB/T 13354-92 | g/cm³ (25°C) | 1.75 | 1.14 |
Mixing & Application Process- epoxy potting compound
| Test Item | Unit | Value |
|---|---|---|
| Mixing Ratio (by weight) | — | 100:25 |
| Mixing Ratio (by volume) | — | 100:40 |
| Mixed Viscosity | mPa·s (25°C) | 700–1200 |
| Mixed Density | g/cm³ (25°C) | 1.57 |
| Working Time | min (25°C) | 40 |
| Curing Schedule | °C/hr | 80°C/1 hr or 25°C/10 hr |
Note: Working time is based on a 100g resin sample.
Instructions for Use
- Measure parts A and B, of Supex 1102 epoxy potting compound, in correct ratio, mix thoroughly in one direction to avoid excessive air bubbles.
- Stir well at the bottom and edges of the container to ensure uniformity.
- Vacuum de-gas the mixture during the working period for improved performance.
If the product volume is large, conduct potting in stages. Cure at 80°C for 60 minutes or at 25°C for 10 hours.
Precautions
- Part A may show sedimentation over time. Stir well before use and reseal tightly.
- Low ambient temperature will slow the curing process. Use heat to accelerate curing if needed.
- Do not cure directly at 80°C if potting thickness exceeds 2 cm—this may cause excessive exothermic reaction.
Heat released during curing varies by amount used; working time should be adjusted accordingly.
Typical Cured Properties
| Test Item | Standard | Unit | Value |
|---|---|---|---|
| Hardness | GB/T 531.1-2008 | Shore D | 80 |
| Thermal Conductivity | GB/T 10297-1998 | W/m·K | 0.4 |
| Coefficient of Expansion | GB/T 20673-2006 | μm/(m·°C) | 44 |
| Water Absorption | GB/T 8810-2005 | 24h, 25°C, % | <0.1 |
| Dielectric Strength | GB/T 1693-2007 | kV/mm (25°C) | >20 |
| Dissipation Factor | GB/T 1693-2007 | (1MHz) (25°C) | 0.014 |
| Dielectric Constant | GB/T 1693-2007 | (1MHz) (25°C) | 3.53 |
| Volume Resistivity | GB/T 1692-92 | Ω·cm (DC500V) | 1.2 × 10¹⁵ |
| Glass Transition Temp. | — | °C | 105 |
Packaging : Part A: 20 kg pail, Part B: 5 kg pail
Best epoxy potting compound in India
Call / Whatsapp: +91 9699892782,
Email: sales@supex.in
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