SUPEX 1102 – Epoxy PCB Potting Compound

Give sensitive electronic assemblies a strong protective barrier against moisture, dirt and environmental contaminants with SUPEX 1102 PCB Potting Compound. Protect Your PCB. Protect Your Electronics.

SUPEX 1102 is a two-component epoxy potting compound designed for the structural protection and encapsulation of high-strength and sensitive electronic products. It can cure at room temperature or with heat, forming a protective encapsulation around electronic assemblies.

Why Choose SUPEX 1102 for PCB Potting?

PCB assemblies can be exposed to moisture, dirt, contaminants and demanding operating conditions. PCB potting helps encapsulate sensitive electronics and provides an additional layer of mechanical and environmental protection.

SUPEX 1102 offers:

• High mechanical strength
• Protection against moisture, dirt and environmental contaminants
• Suitable for sensitive and confidential electronic applications
• Solvent-free formulation
• No cure by-products
• Stable mechanical and electrical properties from -45°C to 120°C
• Room-temperature or heat curing
• Protective encapsulation for electronic products

Epoxy PCB Potting for Electronic Protection

SUPEX 1102 is formulated for applications where strong, reliable encapsulation of electronic components and PCB assemblies is required.

After curing, the epoxy potting compound provides high mechanical strength along with stable electrical and mechanical properties. This makes SUPEX 1102 suitable for protecting sensitive electronic products from environmental exposure.

Easy Processing with Room-Temperature or Heat Cure

SUPEX 1102 is a two-component system consisting of Part A and Part B.

The TDS specifies:

• Mixing ratio by weight: 100:25
• Mixing ratio by volume: 100:40
• Working time: approximately 40 minutes at 25°C
• Curing: 25°C for 10 hours or 80°C for 60 minutes

For improved final performance, the mixed material should be thoroughly blended and vacuum-degassed to remove trapped air before potting.

Electrical & Mechanical Performance

SUPEX 1102 provides strong electrical insulation and mechanical protection after curing.

Values are typical cured properties based on the conditions specified in the SUPEX 1102 Technical Data Sheet.

Applications

SUPEX 1102 can be considered for:

• PCB potting
• Electronic component encapsulation
• Protection of sensitive electronic assemblies
• Structural protection of electronic products
• Encapsulation where moisture and environmental protection is required
• Sensitive or confidential electronic applications

The product is specifically described in the TDS for structural protection of high-strength or sensitive electronic products and protective encapsulation.

Product Packaging

SUPEX 1102 is supplied as a two-component system:

• Part A: 20 kg/pail
• Part B: 5 kg/pail

Storage & Shelf Life

Store the product sealed in a cool, dry location away from light and heat. The recommended storage temperature is 10–40°C.

• Part A: 12 months
• Part B: 6 months at 25°C

Looking for Reliable PCB Potting?

Don’t leave sensitive electronics exposed. Encapsulate them with SUPEX 1102.

If you are looking for PCB potting compound, epoxy PCB potting, electronic potting compound or PCB encapsulation material, contact SUPEX for technical information and application guidance.

Contact SUPEX

Anagha ASF LLP
📞 Call / WhatsApp: +91 9699892782

Contact SUPEX today for product information, technical guidance and bulk requirements.