Supex PU 1524 Polyurethane Potting Compound

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Product description

When it comes to safeguarding printed circuit boards in tough conditions, a reliable PCB potting compound makes all the difference. Supex PU 1524 stands out as a premium black polyurethane option. This two-component system cures at room temperature or with heat, offering robust encapsulation for electronics exposed to harsh environments.

Mixing ratio- PCB potting compound

Mix components A (black liquid) and B (brown liquid) in an easy 5:1 weight ratio. The blend yields a manageable viscosity of about 1000 mPa·s, giving you around 40 minutes of working time at 25°C. Cure fully in 24 hours at room temperature or accelerate to 2 hours at 80°C. The result? A tough, elastic material that absorbs shocks effectively.

This PCB potting compound excels in moisture resistance, blocking dirt and environmental contaminants. It delivers high strength and tenacity for lasting durability. Best of all, it’s solvent-free with no by-products during curing, ensuring a clean process.

Performance remains stable across a wide range from -45°C to 120°C, ideal for demanding applications. The cured material achieves Shore A 80 hardness, balancing flexibility and rigidity. It offers thermal conductivity of 0.55 W/m·K to manage heat dissipation. Low water absorption under 0.2% keeps internals dry.

Safety features include UL-94 V-0 flame retardancy. Electrical properties shine with dielectric strength over 16 kV/mm and volume resistivity exceeding 1.0 × 10¹⁴ Ω·cm.

For optimal results, stir thoroughly and degas under vacuum to eliminate bubbles. Pour in layers for thicker applications. Avoid direct high-heat curing on deep pots to prevent issues.

Other details

Engineers choose this PCB potting compound for automotive, industrial, and outdoor electronics. It provides superior protection without complexity.

Overall, Supex PU 1524 combines ease of use with professional-grade defense. Extend the life of your assemblies against vibration, humidity, and temperature swings. (318 words)

PCB potting compound is essential for protecting electronic circuits in challenging settings.

Applications

Usage instructions

Application Process:

Testing Item	Unit/Condition	Value
Mixing Ratio	Weight Ratio	100:20
Mixed Viscosity (25°C)	mPa·s	1000 ±300
Mixture Density (25°C)	g/cm³	1.52 ±0.05
Working Time (1)	min (25°C)	40 ±20
Curing Time	°C/hr	80/2 or 25/24

Note: Working time based on 60g of mixed material.

To use, mix components A and B at the correct ratio, stir thoroughly, and remove any trapped air via vacuum during the pot life. Pour the compound onto the product to be potted. For large-volume applications, pot in stages. Cure at 80°C for 2 hours or at 25°C for 24 hours.

Technical details

General Properties:

Testing Item	Standard	Unit	A	B
Appearance	Visual Inspection	—	Black liquid	Brown liquid
Viscosity (25°C)	GB/T 10247-2008	mPa·s	5500 ±1500	100 ±50
Density (25°C)	GB/T 13354-92	g/cm³	1.60 ±0.05	1.21 ±0.05

Typical Properties (Cured Material):

Testing Item	Standard	Unit	Value
Hardness	GB/T 531.1-2008	Shore A	80 ±5
Thermal Conductivity	GB/T 10297-1998	W/m·K	0.55
Thermal Expansion Coefficient	GB/T 20673-2006	μm/(m·°C)	120
Water Absorption (24h, 25°C)	GB/T 8810-2005	%	<0.2
Flame Retardancy	UL-94	—	V-0
Dielectric Strength (25°C)	GB/T 1695-2005	kV/mm	>16
Dissipation Factor (1MHz, 25°C)	GB/T 1693-2007	—	0.132
Dielectric Constant (1MHz, 25°C)	GB/T 1693-2007	—	4.32
Volume Resistivity (DC 500V)	GB/T 1692-92	Ω·cm	>1.0×10¹⁴