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Supex 1102 Epoxy Potting Compound

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Supex 4005 Electronics SIlicone Glue

Description of Supex potting epoxy

  • Supex 1102 Epoxy Potting Compound is a room temperature or heat-curing epoxy resin. This two-component adhesive is designed for high-strength and secure electronic applications. 
  • Supex 1102 cures at room temperature without the need for heating. When parts A and B are thoroughly mixed in a 4:1 weight ratio, the product cures over time to form a protective barrier.

Post-Curing Characteristics

  • Resistant to moisture, dust, and other environmental factors
  • High mechanical strength  
  • Provides confidentiality (tamper resistance) 
  • Solvent-free, with no curing by-products  
  • Stable mechanical and electrical properties between -45°C and 120°C

Typical Physical Properties (Before Mixing)

Test ItemTesting StandardUnitPart APart B
AppearanceVisual inspectionBlack viscous liquidBrown liquid
ViscosityGB/T 10247-2008mPa·s (25°C)15,000–35,000100–150
DensityGB/T 13354-92g/cm³ (25°C)1.751.14

Mixing & Application Process- epoxy potting compound

Test ItemUnitValue
Mixing Ratio (by weight)100:25
Mixing Ratio (by volume)100:40
Mixed ViscositymPa·s (25°C)700–1200
Mixed Densityg/cm³ (25°C)1.57
Working Timemin (25°C)40
Curing Schedule°C/hr80°C/1 hr or 25°C/10 hr

Instructions for Use

  • Measure parts A and B, of Supex 1102 epoxy potting compound, in correct ratio, mix thoroughly in one direction to avoid excessive air bubbles.
  • Stir well at the bottom and edges of the container to ensure uniformity. 
  • Vacuum de-gas the mixture during the working period for improved performance. 
  • If the product volume is large, conduct potting in stages. Cure at 80°C for 60 minutes or at 25°C for 10 hours.


Precautions

  • Part A may show sedimentation over time. Stir well before use and reseal tightly.
  • Low ambient temperature will slow the curing process. Use heat to accelerate curing if needed. 
  • Do not cure directly at 80°C if potting thickness exceeds 2 cm—this may cause excessive exothermic reaction.
  • Heat released during curing varies by amount used; working time should be adjusted accordingly.


Typical Cured Properties

Test ItemStandardUnitValue
HardnessGB/T 531.1-2008Shore D80
Thermal ConductivityGB/T 10297-1998W/m·K0.4
Coefficient of ExpansionGB/T 20673-2006μm/(m·°C)44
Water AbsorptionGB/T 8810-200524h, 25°C, %<0.1
Dielectric StrengthGB/T 1693-2007kV/mm (25°C)>20
Dissipation FactorGB/T 1693-2007(1MHz) (25°C)0.014
Dielectric ConstantGB/T 1693-2007(1MHz) (25°C)3.53
Volume ResistivityGB/T 1692-92Ω·cm (DC500V)1.2 × 10¹⁵
Glass Transition Temp.°C105

Packaging : Part A: 20 kg pail, Part B: 5 kg pail

Why Choose Supex epoxy potting compound

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Brand Name
Supex
Product Name
Supex 4005 silicone glue
Weight 15 kg
Dimensions 42 × 20 × 24 cm