Supex 2210 Silicone Potting Compound

Supex 1102 is a two-component epoxy potting compound designed for durable protection of electronic assemblies. It cures at room temperature or with added heat to form a rigid, moisture-resistant encapsulation that shields components from dust, vibration, and environmental stress. With strong mechanical performance and stable properties from –45°C to +120°C, it is ideal for potting power modules, sensors, drivers, and other sensitive electronics.

100% Authentic products

25+ Years of expertise

Pan-India delivery

100% Authentic products

25+ Years of expertise

Pan-India delivery

Product description

In the world of electronics, reliable protection is key. That’s where electronic potting silicone comes in. Supex 2210 stands out as a two-part compound designed for shielding sensitive components. It cures at room temperature or with gentle heat, forming a flexible barrier against harsh conditions.

Supex 2210 Electronics potting silicone

Mix parts A and B in a simple 1:1 ratio. The black and white viscous liquids blend into a smooth material with a viscosity around 4000 mPa·s. This makes it easy to pour into molds or enclosures. Once mixed, you have about 50 minutes of working time at 25°C. Cure it fully in 10 hours at room temp or just 30 minutes at 60°C.

What sets this electronic potting silicone apart? It resists moisture, dust, and pollutants. It absorbs mechanical shocks and thermal stresses, reducing vibration damage. Plus, it’s solvent-free, producing no by-products during cure. The cured form maintains stable properties from -50°C to 250°C, ensuring long-term performance.

Repairing is straightforward too. If needed, you can access components without hassle. It boasts excellent electrical insulation, with dielectric strength over 25 kV/mm and volume resistivity at 1.0 × 10¹⁵ Ω·cm. Flame retardancy reaches UL-94 V-0, making it safe for high-risk applications.

How to use

For best results, stir components well before use. Vacuum degas after mixing to remove air bubbles. Avoid contact with substances containing nitrogen, sulfur, or heavy metals, as they might hinder curing. Store in cool, dry places for a one-year shelf life.

Engineers love this electronic potting silicone for its thermal conductivity of 0.8 W/m·K and low water absorption. It expands minimally with temperature changes, at 210 µm/(m·°C). Whether potting large volumes or thin layers, pour in stages for even results.

In automotive, aerospace, or consumer gadgets, Supex 2210 delivers. It’s non-hazardous for transport and comes in 10 kg pails per part. Choose electronic potting silicone that combines ease with endurance.

This compound excels in high-frequency electrical setups. Its dissipation factor is 0.01, and dielectric constant is 3.3 at 1MHz. Hardness hits Shore A 55, balancing flexibility and strength.

Overall, electronic potting silicone like Supex 2210 protects investments. It prevents failures from environmental factors, extending device life. With uniform mixing and proper curing, achieve optimal outcomes every time

Applications

Standard Properties:
Test Item
Test Standard
Appearance
Unit A (Component A) B (Component B)
Visual Inspection —
Black viscous liquid White viscous liquid
Viscosity (25°C) GB/T 10247-2008 mPa·s 4500 ± 600
Density (25°C) GB/T 13354-92 g/cm³ 1.50 ± 0.05
3500 ± 600
1.50 ± 0.05
Application Process:
Test Item
Unit/Condition Value
Mixing Ratio
Weight & Volume 1:1
Mixed Viscosity mPa·s (25°C)
4000 ± 1000
Mixture Density g/cm³ (25°C)
Working Time (1) min (25°C)
Curing Time
°C/hr
1.50 ± 0.05
50 ± 10
60/0.5 or 25/10
Working time is based on 100g of material.

  1. Measure & Mix
    Measure Part A and Part B in the correct mixing ratio. Mix thoroughly in one direction to minimise air entrapment. Ensure you scrape the sides and bottom of the container for a uniform blend.

  2. De-gas the Mixture
    Vacuum de-gas the mixture during the working time to remove air bubbles and improve the final mechanical and electrical performance.

  3. Potting Process
    For large-volume potting, pour in multiple stages to avoid excessive heat buildup. Ensure each layer gels before adding the next.

  4. Curing
    Cure at 80°C for 1 hour or 25°C for 10 hours, depending on process requirements.

Properties Before Mixing

Test ItemTesting StandardUnitPart APart B
AppearanceVisual inspectionBlack viscous liquidBrown liquid
ViscosityGB/T 10247-2008mPa·s (25°C)15,000–35,000100–150
DensityGB/T 13354-92g/cm³ (25°C)1.751.14

Cured Properties

Test ItemStandardUnitValue
HardnessGB/T 531.1-2008Shore D80
Thermal ConductivityGB/T 10297-1998W/m·K0.4
Coefficient of ExpansionGB/T 20673-2006μm/(m·°C)44
Water AbsorptionGB/T 8810-200524h, 25°C, %<0.1
Dielectric StrengthGB/T 1693-2007kV/mm (25°C)>20
Dissipation FactorGB/T 1693-2007(1MHz) (25°C)0.014
Dielectric ConstantGB/T 1693-2007(1MHz) (25°C)3.53
Volume ResistivityGB/T 1692-92Ω·cm (DC500V)1.2 × 10¹⁵
Glass Transition Temp.°C105

Packaging : Part A: 20 kg pail, Part B: 5 kg pail

Additional information

Weight

15kg

Dimensions

42 × 20 × 24 cm

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