Supex 1102 Epoxy Potting Compound

Supex 1102 is a two-component epoxy potting compound designed for durable protection of electronic assemblies. It cures at room temperature or with added heat to form a rigid, moisture-resistant encapsulation that shields components from dust, vibration, and environmental stress. With strong mechanical performance and stable properties from –45°C to +120°C, it is ideal for potting power modules, sensors, drivers, and other sensitive electronics.

100% Authentic products

25+ Years of expertise

Pan-India delivery

100% Authentic products

25+ Years of expertise

Pan-India delivery

Product description

Supex 1102: Best Potting Epoxy – Two-Part Epoxy Potting Compound in India

Discover Supex 1102 – Reliable Potting Epoxy for Electronics

You protect sensitive electronics every day. Supex 1102 handles it perfectly. This two-component potting epoxy encapsulates components securely. It forms a rigid, moisture-resistant barrier. Manufacturers in India choose it for power supplies, sensors, and LED drivers. Moreover, it cures at room temperature or with heat. Therefore, it delivers long-term reliability in tough conditions.

First, see its core strength. Supex 1102 shields against dust, vibration, moisture, and stress. It maintains stable properties from –45°C to +120°C. As a result, your assemblies last longer and perform better.

Key Features of Supex 1102 Potting Epoxy

Supex 1102 stands out as a high-performance epoxy potting compound. Check these highlights:

  • Two-component system – Mix Part A and Part B at 100:25 by weight (4:1 ratio).
  • Solvent-free formula – Produces no by-products; keeps processes clean.
  • Low mixed viscosity – 700–1200 mPa·s for easy flow and bubble-free potting.
  • Room-temperature or heat cure – 10 hours at 25°C or 1 hour at 80°C.
  • High hardness – Shore D 80 after cure for strong protection.
  • Excellent electrical insulation – Dielectric strength >20 kV/mm; volume resistivity 1.2 × 10¹⁵ Ω·cm.
  • Wide temperature range – Stable from –45°C to +120°C; Tg 105°C.
  • Low water absorption – <0.1% (24h at 25°C) for moisture resistance.
  • Tamper-resistant encapsulation – Adds security and prevents unauthorized access.
  • Good thermal conductivity – 0.4 W/m·K for heat dissipation.

Additionally, it offers high mechanical strength. This makes it ideal for demanding electronics.

Why Choose This Epoxy Potting Compound?

Potting epoxies like Supex 1102 outperform many alternatives. They create rigid barriers without shrinkage issues. For example, they protect against environmental stress effectively. In contrast, some compounds weaken over time or absorb moisture. Supex 1102 stays stable and reliable.

Engineers trust it for precision work. It suits high-value components. Plus, its solvent-free design meets eco standards. Consequently, it fits modern manufacturing in India.

Top Applications for Supex 1102 Potting Epoxy

Use Supex 1102 potting epoxy in these key areas:

  • Power electronics – Pot power supplies, modules, and coils.
  • Sensors and drivers – Encapsulate LED drivers, sensors, and controls.
  • High-value assemblies – Protect PCBs and sensitive circuits.
  • Industrial electronics – Shield components in harsh environments.
  • Other uses – Encapsulate transformers, relays, and connectors.

It works well for both small and large-volume potting. Therefore, one product covers diverse needs.

Simple Application Steps for Supex 1102

Follow these steps to apply Supex potting epoxy.

  1. Stir Part A thoroughly (it may settle).
  2. Measure Parts A and B accurately (100:25 by weight).
  3. Mix in one direction. Scrape sides and bottom for uniformity.
  4. De-gas under vacuum to remove air bubbles.
  5. Pour in stages for thick sections (>2 cm) to control heat.
  6. Cure at 25°C for 10 hours or 80°C for 1 hour.
  7. Avoid direct high-heat cure on thick masses to prevent exotherm.

Clean tools before cure sets. Store sealed at cool temperatures.

Benefits for Indian Electronics Manufacturers

India’s electronics sector grows fast. Supex 1102 supports it with consistent quality and pan-India delivery. It enhances product durability and IP protection. Plus, Supex offers 25+ years of expertise from Mumbai.

Choose Supex 1102 today. It provides superior encapsulation and electrical protection. For the best potting epoxy and epoxy potting compound in India, this product leads the way.

Applications

 

UnitValue
Mixing Ratio (by weight)100:25
Mixing Ratio (by volume)100:40
Mixed ViscositymPa·s (25°C)700–1200
Mixed Densityg/cm³ (25°C)1.57
Working Timemin (25°C)40
Curing Schedule°C/hr80°C / 1 hr or 25°C / 10 hr

 

Precautions

  • Part A may settle over time; stir thoroughly before use and reseal immediately after dispensing.

  • Low ambient temperatures increase curing time; gentle heating can accelerate the process.

  • Do not cure directly at 80°C if potting thickness exceeds 2 cm, as this can trigger an intense exothermic reaction.

  • Larger resin masses generate more heat; adjust working time accordingly.

  1. Measure & Mix
    Measure Part A and Part B in the correct mixing ratio. Mix thoroughly in one direction to minimise air entrapment. Ensure you scrape the sides and bottom of the container for a uniform blend.

  2. De-gas the Mixture
    Vacuum de-gas the mixture during the working time to remove air bubbles and improve the final mechanical and electrical performance.

  3. Potting Process
    For large-volume potting, pour in multiple stages to avoid excessive heat buildup. Ensure each layer gels before adding the next.

  4. Curing
    Cure at 80°C for 1 hour or 25°C for 10 hours, depending on process requirements.

Properties Before Mixing

Test ItemTesting StandardUnitPart APart B
AppearanceVisual inspectionBlack viscous liquidBrown liquid
ViscosityGB/T 10247-2008mPa·s (25°C)15,000–35,000100–150
DensityGB/T 13354-92g/cm³ (25°C)1.751.14

Cured Properties

Test ItemStandardUnitValue
HardnessGB/T 531.1-2008Shore D80
Thermal ConductivityGB/T 10297-1998W/m·K0.4
Coefficient of ExpansionGB/T 20673-2006μm/(m·°C)44
Water AbsorptionGB/T 8810-200524h, 25°C, %<0.1
Dielectric StrengthGB/T 1693-2007kV/mm (25°C)>20
Dissipation FactorGB/T 1693-2007(1MHz) (25°C)0.014
Dielectric ConstantGB/T 1693-2007(1MHz) (25°C)3.53
Volume ResistivityGB/T 1692-92Ω·cm (DC500V)1.2 × 10¹⁵
Glass Transition Temp.°C105

Packaging : Part A: 20 kg pail, Part B: 5 kg pail

Additional information

Weight

15kg

Dimensions

42 × 20 × 24 cm

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