Supex PU 1552 potting compound for electronics
Description:
Supex PU 1552 black potting compound for electronicsis a room-temperature or heat-curing organic polyurethane material. This two-component polyurethane compound is designed to provide protection under harsh environmental conditions for electronic products.
Supex PU 1552 cures without the need for heating. When used in a 5:1 weight ratio and thoroughly mixed, the A and B components form an elastic, cushioning material after a specified curing time.
Once cured, the compound offers the following properties:
- Protection against moisture, dust, and other atmospheric elements
- High strength
- High toughness
- Solvent-free with no curing by-products
- Stable mechanical and electrical properties from -45°C to 120°C
Know more about potting compound for electronics
Conventional Performance
| Test Item | Testing Standard | Unit | A | B |
|---|---|---|---|---|
| Appearance | Visual Inspection | — | Black liquid | Brown liquid |
| Viscosity | GB/T 10247-2008 | mPa·s (25°C) | 5500 ± 1500 | 100 ± 50 |
| Density | GB/T 13354-92 | g/cm³ (25°C) | 1.60 ± 0.05 | 1.21 ± 0.05 |
| Test Item | Unit / Conditions | Value |
|---|---|---|
| Mixing ratio (by weight) | — | 100:20 |
| Mixed viscosity | mPa·s (25°C) | 1000 ± 300 |
| Mixture density | g/cm³ (25°C) | 1.52 ± 0.05 |
| Working time¹ | min (25°C) | 40 ± 20 |
| Curing schedule | °C / hours | 80 / 2 or 25 / 24 |
During the operation period, mix components A and B in the correct ratio, stir evenly, and degas under vacuum. If the quantity of the potting material is large, it can be poured in stages. Cure at 80°C for 120 minutes or at 25°C for 24 hours.
Operational Precautions
- Component A may exhibit slight sedimentation over time. Always stir thoroughly before use and reseal after opening.
- Stir in a consistent direction to minimise bubble formation. Ensure the mixture from the container’s sides and bottom is fully blended to avoid localised uncured areas.
- Degas the mixture before and after pouring for optimum cured performance.
- If ambient temperature is too low, curing will be slower — heat curing is recommended. Avoid direct curing above 80°C for layers thicker than 2 cm, as this may cause a violent reaction.
- Supex PU 1552,potting compound for elextronics, may not cure properly when in contact with materials containing nitrogen, sulphur, phosphorus, or heavy metal ions such as tin (Sn), lead (Pb), mercury (Hg), bismuth (Bi), or arsenic (As).
Typical Properties (Cured)
| Test Item | Standard | Unit | Value |
|---|---|---|---|
| Hardness | GB/T 531.1-2008 | Shore A | 80 ± 5 |
| Thermal conductivity | GB/T 10297-1998 | W/m·K | 0.55 |
| Expansion coefficient | GB/T 20673-2006 | µm/(m·°C) | 120 |
| Water absorption | GB/T 8810-2005 (24h, 25°C) | % | < 0.2 |
| Flame retardancy | UL-94 | — | V-0 |
| Dielectric strength | GB/T 1695-2005 | kV/mm (25°C) | >16 |
| Dissipation factor | GB/T 1693-2007 (1MHz, 25°C) | — | 0.132 |
| Dielectric constant | GB/T 1693-2007 (1MHz, 25°C) | — | 4.32 |
| Volume resistivity | GB/T 1692-92 (DC 500V) | Ω·cm | >1.0 × 10¹⁴ |
Packaging
- Component A: 25 kg per pail
Component B: 5 kg per pail
Storage and Transportation
- Store sealed between 10°C and 40°C, away from light and heat. Non-hazardous for transport and storage.
Shelf life:
- Component A: 12 months at 25°C, Component B: 6 months at 25°C
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